The LEDLUM project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No. 731466.
Beside different innovation clusters (e.g. Photonics21, Smart Group Ireland, WiSEN, PEIG), the LEDLUM partners are also connected to other related projects:
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The PowerSwipe proposal will address a key roadblock for PowerSoC by, for the first time, miniaturising and integrating state-of-the-art, high density trench capacitor substrate technology with novel thin film magnetics on silicon to deliver a multi-component LC (inductor-capacitor) interposer which will be combined, in a 3D heterogeneous stack, using eWLB technology, with the µController chip.
CarrICool will deliver a game-changing 3D packaging platform for scale-up of future, many-core, exascale computing systems. The project will also develop a strategic supplier base in Europe for high-end HPC components and systems integration capabilities in the Exascale era
This project aims to accelerate the uptake of high-quality Solid State Lighting (SSL) technology in Europe by supporting open innovation and bringing validated information to all relevant stakeholders.
This project aims to make chargers that are profoundly smaller, lighter and more efficient than any chargers in the market today. Nordic Power Converters (NPC), a spinout from the Technical University of Denmark (DTU), has developed agenerally applicable technology reducing size and cost of power converters significantly while simultaneously increasing efficiency: Size and weight are down 80%, cost down 50%, and efficiency increased from the typical 7585% range of market products to >90%. All of this can be achieved without compromising quality or durability. Downsizing parts of the invention to chip-level will be done in close cooperation with DTU Elektro, who is experts in IC-design.
The GaNonCMOS project aims to bring GaN power electronic materials, devices and systems to the next level of maturity by providing the most densely integrated materials to date. This will be realized by integrating GaN power switches with CMOS drivers densely together using different integration schemes from the package level up to the chip level including wafer bonding between GaN on Si(111) and CMOS on Si (100) wafers. In addition, new soft magnetic core materials reaching switching frequencies up to 200 Mhz with ultralow power losses will be developed. This will be assembled with new materials and methods for miniaturized packages to allow GaN devices, modules and systems to operate under maximum speed and energy efficiency.
The size and cost of the power supply has become a dominant factor in many applications. At the same time, most of the power supplies have large electrolytic capacitators, which are expensive, bulky and often limit the product lifetime. The ambition of the TinyPower project is to develop an integrated switch-mode power supply consisting of an integrated circuit where only a few external components need to be added to achieve a complete product.